Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
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Reference:
ISO 9455-18:2024
Publication Year:
2024
Domain:
This document specifies test methods for the cleanliness of soldered printed circuit assemblies before and/or after soldering and cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.
31 000 F CFA
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