ISO/TS 10303-1741:2018-11 specifies the application module for
Sequential laminate assembly design.

The following are within the scope of
ISO/TS 10303-1741:2018-11:

• sequence of application of an embedded component;
• sequence of material buildup or lamination;
• support for embedded component location;
• items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.