ISO/TS 10303-1685:2018-11 specifies the application module for
Interconnect module to assembly module relationship.

The following are within the scope of
ISO/TS 10303-1685:2018-11:

• assembly requirement for interconnect substrate;
• assembly component based symbol placement in substrate requirement;
• assembly component based annotation text placement in substrate requirement;
• assembly component feature to layout feature requirement relationship;
• external references for assembly component;
• external references for assembly component feature;