ISO/TS 10303-1716:2018-11 specifies the application module for
Layered interconnect complex template.

The following are within the scope of
ISO/TS 10303-1716:2018-11:

• footprint definition;
• footprint definition shape;
• padstack definition;
• padstack definition shape;
• items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
• items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.