ISO/TS 10303-1688:2010-03 specifies the application module for
Interconnect non planar shape.

The following are within the scope of
ISO/TS 10303-1688:2010-03:

• three dimensional manifold surface representation of an interconnect substrate;
• placement of footprint and other planar feature definitions in a three dimensional manifold surface representation
  including changing the planar shape to a manifold shape.